JX Nippon Mining & Metals Develops Ultra-Low Roughness Rolled Copper Foil

JX Nippon Mining & Metals announced on Monday the firm successfully developed ultra-low roughness rolled copper foil at Hitachi works in Ibaraki, Japan. The product is adoptable as flexible printed circuit (FPC) material where high foldability is required. The company soon starts the commercial sales of this new copper foil.

Ultra-low roughness copper foil meets the demand for much thinner circuits used for liquid crystal panels of smart phones or tablet PCs. The surface roughness is halved compared with conventional rolled copper foils while the visibility is largely improved. These characteristics are suitable for drivers of liquid crystal panels.

JX Nippon Mining & Metals explained ultra-low roughness copper foil enables easier locating on precise circuits of FPCs for liquid crystal panel driving modules。 This contributes to lower assembly cost。